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2013 Proceedings Of The Asme 2013 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2013)
idioma: inglês
Editor:
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., dezembro de 2013 ‧
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SINOPSE
This collection of 80 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780791855768 |
| Editor: | AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
| Data de Lançamento: | dezembro de 2013 |
| Idioma: | Inglês |
| Dimensões: | 152 x 229 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 680 |
| Tipo de produto: | Livro |
| Coleção: | U.S. Government: How It Works |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Engenharia Mecânica
|
| EAN: | 9780791855768 |
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