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2013 Proceedings Of The Asme 2013 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2013)
Presented At Asme 2013 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems, July 16
idioma: inglês
Editor:
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., dezembro de 2013 ‧
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SINOPSE
This collection of 86 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780791855751 |
| Editor: | AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
| Data de Lançamento: | dezembro de 2013 |
| Idioma: | Inglês |
| Dimensões: | 152 x 229 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 768 |
| Tipo de produto: | Livro |
| Coleção: | U.S. Government: How It Works |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Engenharia Mecânica
|
| EAN: | 9780791855751 |
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