Three-Dimensional Integration And Modeling

A Revolution In Rf And Wireless Packaging

by Jong-Hoon Lee e Manos M. Tentzeris
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language: english
Publisher: Springer International Publishing AG, December of 2007 ‧
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Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

Three-Dimensional Integration And Modeling

A Revolution In Rf And Wireless Packaging

by Jong-Hoon Lee e Manos M. Tentzeris

Property Description
ISBN: 9783031005756
Publisher: Springer International Publishing AG
Release Date: December of 2007
Language: English
Dimensions: 191 x 235 x 20 mm
Cover: Softcover
Pages: 108
Format: Book
Collection: Synthesis Lectures On Computational Electromagnetics
Categories: Books in English > Engineering > General Engineering
EAN: 9783031005756