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Three-Dimensional Integration And Modeling eBook

A Revolution In Rf And Wireless Packaging

by Jong-Hoon Lee e Manos M. Tentzeris
Book eBook
language: english
Publisher: Springer International Publishing, May of 2022 ‧
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Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

Three-Dimensional Integration And Modeling

A Revolution In Rf And Wireless Packaging

by Jong-Hoon Lee e Manos M. Tentzeris

Property Description
ISBN: 9783031017032
Publisher: Springer International Publishing
Release Date: May of 2022
Language: English
Format: eBook
File Format and Compatibility: PDF para ADE
Collection: Synthesis Lectures On Computational Electromagnetics
Categories: eBooks in English > Engineering > General Engineering
eBooks in English > Engineering > Electricity and Energy
EAN: 9783031017032

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