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Thermoplasmonics
From Principles, Materials And Characterization To Engineering Applications
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, November of 2024 ‧
see product details
170,33€
10% OFF
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SYNOPSIS
This book is built on the recent advancements in understanding thermoplasmonics and highlights the exciting new directions that are shaping this field.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789819783311 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | November of 2024 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 181 |
| Format: | Book |
| Categories: |
Books in English
>
Science
>
Physical
|
| EAN: | 9789819783311 |
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Communication Electronic CircuitsDe Gruyter79,83€