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Thermal Reliability Of Power Semiconductor Device In The Renewable Energy System

by Jun Zhang, Rui Du, Cheng Qian, Gaoxian Li, Yaoyi Yu e Xiong Du
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, July of 2023 ‧
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This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management.

Thermal Reliability Of Power Semiconductor Device In The Renewable Energy System

by Jun Zhang, Rui Du, Cheng Qian, Gaoxian Li, Yaoyi Yu e Xiong Du

Property Description
ISBN: 9789811931345
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: July of 2023
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 172
Format: Book
Collection: Cpss Power Electronics Series
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9789811931345