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Thermal Reliability Of Power Semiconductor Device In The Renewable Energy System

by Jun Zhang, Rui Du, Xiong Du, Yaoyi Yu, Cheng Qian e Gaoxian Li
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, July of 2022 ‧
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This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management.

Thermal Reliability Of Power Semiconductor Device In The Renewable Energy System

by Jun Zhang, Rui Du, Xiong Du, Yaoyi Yu, Cheng Qian e Gaoxian Li

Property Description
ISBN: 9789811931314
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: July of 2022
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 172
Format: Book
Collection: Cpss Power Electronics Series
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9789811931314