Thermal Management Of Microelectronic Equipment

Heat Transfer Theory, Analysis Methods And Design Practices

by Richard C. Chu e Lian-Tuu Yeh
language: english
Publisher: AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., June of 2002 ‧
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With this systematic examination of the factors that govern the thermal performance of electronics, the authors solve design problems encountered in developing and analysing very-high-performance and high-heat-dissipation devices, as well as intermediate and lower-power devices.

Thermal Management Of Microelectronic Equipment

Heat Transfer Theory, Analysis Methods And Design Practices

by Richard C. Chu e Lian-Tuu Yeh

Property Description
ISBN: 9780791801680
Publisher: AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S.
Release Date: June of 2002
Language: English
Dimensions: 162 x 230 x 29 mm
Cover: Softcover
Pages: 440
Format: Book
Collection: Asme Press Series On Electronic Packaging
Categories: Books in English > Engineering > General Engineering
EAN: 9780791801680