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Thermal Design Of Liquid Cooled Microelectronic Equipment
language: english
Publisher:
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., January of 2020 ‧
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SYNOPSIS
Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9780791861936 |
| Publisher: | AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
| Release Date: | January of 2020 |
| Language: | English |
| Cover: | Hardcover |
| Pages: | 277 |
| Format: | Book |
| Collection: | Asme Press Book Series On Electronic Packaging |
| Categories: |
Books in English
>
Engineering
>
Mechanical Engineering
Books in English > Others |
| EAN: | 9780791861936 |
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