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Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium

Epits 2024, 26-27 August, Ho Chi Minh City, Vietnam

language: english
Publisher: Springer Nature Switzerland AG, March of 2025 ‧
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This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology.

Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium

Epits 2024, 26-27 August, Ho Chi Minh City, Vietnam

Property Description
ISBN: 9789819628704
Publisher: Springer Nature Switzerland AG
Release Date: March of 2025
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 421
Format: Book
Collection: Springer Proceedings In Physics
Categories: Books in English > Science > Physical
EAN: 9789819628704