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Power Electronic Packaging

Design, Assembly Process, Reliability And Modeling

by Yong Liu
language: english
Publisher: SPRINGER-VERLAG NEW YORK INC., April of 2014 ‧
297,40€
208,18€
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling.

Power Electronic Packaging

Design, Assembly Process, Reliability And Modeling

by Yong Liu

Property Description
ISBN: 9781489987976
Publisher: SPRINGER-VERLAG NEW YORK INC.
Release Date: April of 2014
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 594
Format: Book
Categories: Books in English > Science > Chemical
EAN: 9781489987976