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Interconnect Reliability In Advanced Memory Device Packaging

by Chen-Yu, Huang e Chong Leong, Gan
language: english
Publisher: Springer International Publishing AG, April of 2024 ‧
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This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.

Interconnect Reliability In Advanced Memory Device Packaging

by Chen-Yu, Huang e Chong Leong, Gan

Property Description
ISBN: 9783031267109
Publisher: Springer International Publishing AG
Release Date: April of 2024
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 210
Format: Book
Collection: Springer Series In Reliability Engineering
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9783031267109