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Die-Stacking Architecture

by Jishen Zhao e Yuan Xie
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language: english
Publisher: Springer International Publishing AG, June of 2015 ‧
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The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.

Die-Stacking Architecture

by Jishen Zhao e Yuan Xie

Property Description
ISBN: 9783031006197
Publisher: Springer International Publishing AG
Release Date: June of 2015
Language: English
Dimensions: 191 x 235 x 20 mm
Cover: Softcover
Pages: 113
Format: Book
Collection: Synthesis Lectures On Computer Architecture
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9783031006197

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