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Die-Stacking Architecture
Book
eBook
language: english
Publisher:
Springer International Publishing AG, June of 2015 ‧
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SYNOPSIS
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9783031006197 |
| Publisher: | Springer International Publishing AG |
| Release Date: | June of 2015 |
| Language: | English |
| Dimensions: | 191 x 235 x 20 mm |
| Cover: | Softcover |
| Pages: | 113 |
| Format: | Book |
| Collection: | Synthesis Lectures On Computer Architecture |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
|
| EAN: | 9783031006197 |
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