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Die-Stacking Architecture eBook

by Jishen Zhao e Yuan Xie
Book eBook
language: english
Publisher: Springer International Publishing, May of 2022 ‧
46,36€
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The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.

Die-Stacking Architecture

by Jishen Zhao e Yuan Xie

Property Description
ISBN: 9783031017476
Publisher: Springer International Publishing
Release Date: May of 2022
Language: English
Pages: 113
Format: eBook
File Format and Compatibility: PDF para ADE
Collection: Synthesis Lectures On Computer Architecture
Categories: eBooks in English > Engineering > Electricity and Energy
eBooks in English > Computing > Operating Systems and Networks
EAN: 9783031017476

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