Capa do artigo 2013 Proceedings Of The Asme 2013 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2013)

2013 Proceedings Of The Asme 2013 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2013)

by American Society Of Mechanical Engineers (Asme)
language: english
Publisher: AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., December of 2013 ‧
230,46€
OUT OF STOCK OR NOT AVAILABLE
Sell ​​your book
This collection of 80 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.

2013 Proceedings Of The Asme 2013 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2013)

by American Society Of Mechanical Engineers (Asme)

Property Description
ISBN: 9780791855768
Publisher: AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S.
Release Date: December of 2013
Language: English
Dimensions: 152 x 229 x 20 mm
Cover: Softcover
Pages: 680
Format: Book
Collection: U.S. Government: How It Works
Categories: Books in English > Engineering > Mechanical Engineering
EAN: 9780791855768

BOOKS FROM THE SAME COLLECTION

AMERICAN SOCIETY OF MECHANICAL ENGINEERS (ASME)

SEE MORE TITLES BY THIS AUTHOR