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2013 Proceedings Of The Asme 2013 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2013)
Presented At Asme 2013 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems, July 16
language: english
Publisher:
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., December of 2013 ‧
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SYNOPSIS
This collection of 86 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.
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| Property | Description |
|---|---|
| ISBN: | 9780791855751 |
| Publisher: | AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
| Release Date: | December of 2013 |
| Language: | English |
| Dimensions: | 152 x 229 x 20 mm |
| Cover: | Softcover |
| Pages: | 768 |
| Format: | Book |
| Collection: | U.S. Government: How It Works |
| Categories: |
Books in English
>
Engineering
>
Mechanical Engineering
|
| EAN: | 9780791855751 |
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