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Thermomechanical Simulation Methodologies For Advanced Semiconductor Packaging eBook
language: english
Publisher:
The Institution of Engineering and Technology, June of 2025 ‧
see product details
172,92€
10% OFF
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
IMMEDIATE AVAILABILITY
Ebook for ADE
SYNOPSIS
Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9781837245444 |
| Publisher: | The Institution of Engineering and Technology |
| Release Date: | June of 2025 |
| Language: | English |
| Format: | eBook |
| File Format and Compatibility: | |
| Categories: |
eBooks in English
>
Engineering
>
Electricity and Energy
|
| EAN: | 9781837245444 |
| Acessibilidade: | Ver características de acessibilidade indicadas pelo editor |