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Thermomechanical Simulation Methodologies For Advanced Semiconductor Packaging eBook
language: english
Publisher:
The Institution of Engineering and Technology, June of 2025 ‧
see product details
172,92€
10% OFF
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IMMEDIATE AVAILABILITY
Ebook for ADE
SYNOPSIS
Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9781837241415 |
| Publisher: | The Institution of Engineering and Technology |
| Release Date: | June of 2025 |
| Language: | English |
| Format: | eBook |
| File Format and Compatibility: | PDF para ADE |
| Categories: |
eBooks in English
>
Engineering
>
Electricity and Energy
|
| EAN: | 9781837241415 |