Capa do artigo Testing Of Interposer-Based 2.5d Integrated Circuits
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Testing Of Interposer-Based 2.5d Integrated Circuits eBook

by Ran Wang e Krishnendu Chakrabarty
language: english
Publisher: Springer International Publishing, March of 2017 ‧
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The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

Testing Of Interposer-Based 2.5d Integrated Circuits

by Ran Wang e Krishnendu Chakrabarty

Property Description
ISBN: 9783319547145
Publisher: Springer International Publishing
Release Date: March of 2017
Language: English
Format: eBook
File Format and Compatibility: PDF para ADE
Collection: Engineering
Categories: eBooks in English > Engineering > Electricity and Energy
eBooks in English > Computing > Operating Systems and Networks
EAN: 9783319547145

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