10% OFF

Testing Of Interposer-Based 2.5d Integrated Circuits

by Ran Wang e Krishnendu Chakrabarty
language: english
Publisher: Springer International Publishing AG, May of 2018 ‧
135,18€
10% OFF CARD
free shipping
Sell ​​your book
The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

Testing Of Interposer-Based 2.5d Integrated Circuits

by Ran Wang e Krishnendu Chakrabarty

Property Description
ISBN: 9783319854618
Publisher: Springer International Publishing AG
Release Date: May of 2018
Language: English
Dimensions: 156 x 234 x 11 mm
Cover: Softcover
Pages: 182
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9783319854618