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Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion Barrier Ru For Cu Interconnect eBook

by Jie Cheng
language: english
Publisher: Springer Nature Singapore, September of 2017 ‧
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This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.

Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion Barrier Ru For Cu Interconnect

by Jie Cheng

Property Description
ISBN: 9789811061653
Publisher: Springer Nature Singapore
Release Date: September of 2017
Language: English
Format: eBook
File Format and Compatibility:
Collection: Springer Theses
Categories: eBooks in English > Engineering > General Engineering
EAN: 9789811061653
Acessibilidade: Ver características de acessibilidade indicadas pelo editor