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Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion Barrier Ru For Cu Interconnect

by Jie Cheng
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, January of 2019 ‧
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This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.

Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion Barrier Ru For Cu Interconnect

by Jie Cheng

Property Description
ISBN: 9789811355851
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: January of 2019
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 137
Format: Book
Collection: Springer Theses
Categories: Books in English > Engineering > General Engineering
Books in English > Engineering > Mechanical Engineering
EAN: 9789811355851