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Power, Thermal, Noise, And Signal Integrity Issues On Substrate/Interconnects Entanglement eBook

by Christian Gontrand e Yue Ma
language: english
Publisher: CRC PRESS, March of 2019 ‧
74,19€
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New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Power, Thermal, Noise, And Signal Integrity Issues On Substrate/Interconnects Entanglement

by Christian Gontrand e Yue Ma

Property Description
ISBN: 9780429680076
Publisher: CRC PRESS
Release Date: March of 2019
Language: English
Format: eBook
File Format and Compatibility: PDF para ADE
Categories: eBooks in English > Engineering > Electricity and Energy
EAN: 9780429680076