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Power, Thermal, Noise, And Signal Integrity Issues On Substrate/Interconnects Entanglement

by Christian Gontrand e Yue Ma
language: english
Publisher: TAYLOR & FRANCIS LTD, March of 2019 ‧
189,26€
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New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Power, Thermal, Noise, And Signal Integrity Issues On Substrate/Interconnects Entanglement

by Christian Gontrand e Yue Ma

Property Description
ISBN: 9780367023430
Publisher: TAYLOR & FRANCIS LTD
Release Date: March of 2019
Language: English
Dimensions: 156 x 235 x 20 mm
Cover: Hardcover
Pages: 226
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9780367023430