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Packaging Of High Power Semiconductor Lasers eBook

by Hui Liu, Lingling Xiong, Xingsheng Liu e Wei Zhao
language: english
Publisher: SPRINGER NEW YORK, July of 2014 ‧
198,09€
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Ebook for ADE
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Packaging Of High Power Semiconductor Lasers

by Hui Liu, Lingling Xiong, Xingsheng Liu e Wei Zhao

Property Description
ISBN: 9781461492634
Publisher: SPRINGER NEW YORK
Release Date: July of 2014
Language: English
Format: eBook
File Format and Compatibility: PDF para ADE
Categories: eBooks in English > Engineering > Electricity and Energy
EAN: 9781461492634