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Packaging Of High Power Semiconductor Lasers

by Hui Liu, Lingling Xiong, Xingsheng Liu e Wei Zhao
Publisher: SPRINGER-VERLAG NEW YORK INC., July of 2014 ‧
202,77€
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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Packaging Of High Power Semiconductor Lasers

by Hui Liu, Lingling Xiong, Xingsheng Liu e Wei Zhao

Property Description
ISBN: 9781461492627
Publisher: SPRINGER-VERLAG NEW YORK INC.
Release Date: July of 2014
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 402
Format: Book
Collection: Micro- And Opto-Electronic Materials, Structures, And Systems
Categories: Books in English > Engineering > General Engineering
EAN: 9781461492627

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