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Introduction To Microsystem Packaging Technology eBook
language: english
Publisher:
Taylor and Francis Group, December of 2017 ‧
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Ebook for ADE
SYNOPSIS
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
DETeBook com proteção para wookreaderILS
| Property | Description |
|---|---|
| ISBN: | 9781351832977 |
| Publisher: | Taylor and Francis Group |
| Release Date: | December of 2017 |
| Language: | English |
| Format: | eBook |
| Categories: |
eBooks in English
>
Engineering
>
General Engineering
eBooks in English > Engineering > Electricity and Energy |
| EAN: | 9781351832977 |
| Acessibilidade: | Ver características de acessibilidade indicadas pelo editor |
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