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Introduction To Microsystem Packaging Technology

by Zhiping Wang, Jing (Peking University) Chen e Yufeng (Peking University) Jin
language: english
Publisher: TAYLOR & FRANCIS INC, September of 2010 ‧
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Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.

Introduction To Microsystem Packaging Technology

by Zhiping Wang, Jing (Peking University) Chen e Yufeng (Peking University) Jin

Property Description
ISBN: 9781439819104
Publisher: TAYLOR & FRANCIS INC
Release Date: September of 2010
Language: English
Cover: Hardcover
Pages: 232
Format: Book
Categories: Books in English > Engineering > General Engineering
Books in English > Engineering > Electricity and Energy
EAN: 9781439819104