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Introduction To Microsystem Packaging Technology
language: english
Publisher:
TAYLOR & FRANCIS INC, September of 2010 ‧
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SYNOPSIS
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9781439819104 |
| Publisher: | TAYLOR & FRANCIS INC |
| Release Date: | September of 2010 |
| Language: | English |
| Cover: | Hardcover |
| Pages: | 232 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
Books in English > Engineering > Electricity and Energy |
| EAN: | 9781439819104 |