Capa do artigo Hybrid Assemblies And Multichip Modules
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Hybrid Assemblies And Multichip Modules eBook

by Fred W. Kear
language: english
Publisher: CRC PRESS, July of 2020 ‧
225,25€
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Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

Hybrid Assemblies And Multichip Modules

by Fred W. Kear

Property Description
ISBN: 9781000147803
Publisher: CRC PRESS
Release Date: July of 2020
Language: English
Format: eBook
File Format and Compatibility:
Collection: Manufacturing Engineering And Materials Processing
Categories: eBooks in English > Engineering > General Engineering
eBooks in English > Engineering > Hydraulic Engineering
EAN: 9781000147803
Acessibilidade: Ver características de acessibilidade indicadas pelo editor

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