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Hybrid Assemblies And Multichip Modules

by Fred W. Kear
language: english
Publisher: TAYLOR & FRANCIS INC, December of 1992 ‧
229,82€
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Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

Hybrid Assemblies And Multichip Modules

by Fred W. Kear

Property Description
ISBN: 9780824784669
Publisher: TAYLOR & FRANCIS INC
Release Date: December of 1992
Language: English
Cover: Hardcover
Pages: 296
Format: Book
Collection: Manufacturing Engineering And Materials Processing
Categories: Books in English > Engineering > Mechanical Engineering
EAN: 9780824784669