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3d Ic And Rf Sips: Advanced Stacking And Planar Solutions For 5g Mobility eBook

by Lih-Tyng Hwang e Tzyy-Sheng Jason Horng
language: english
Publisher: WILEY, March of 2018 ‧
153,63€
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Advanced Stacking and Planar Solutions for 5G Mobility. An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

3d Ic And Rf Sips: Advanced Stacking And Planar Solutions For 5g Mobility

by Lih-Tyng Hwang e Tzyy-Sheng Jason Horng

Property Description
ISBN: 9781119289661
Publisher: WILEY
Release Date: March of 2018
Language: English
Format: eBook
File Format and Compatibility:
Categories: eBooks in English > Engineering > Electricity and Energy
EAN: 9781119289661
Acessibilidade: Ver características de acessibilidade indicadas pelo editor