3d Ic And Rf Sips: Advanced Stacking And Planar Solutions For 5g Mobility

Name: 3d Ic And Rf Sips: Advanced Stacking And Planar Solutions For 5g Mobility
Price: 156.75 EUR
Author: Lih-Tyng Hwang e Tzyy-Sheng Jason Horng
ISBN: 9781119289647

by Lih-Tyng Hwang e Tzyy-Sheng Jason Horng

language: english

Publisher: JOHN WILEY & SONS INC, June of 2018 ‧ see product details

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SYNOPSIS

Advanced Stacking and Planar Solutions for 5G Mobility. An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

DETAILS

3d Ic And Rf Sips: Advanced Stacking And Planar Solutions For 5g Mobility

by Lih-Tyng Hwang e Tzyy-Sheng Jason Horng
Property	Description
ISBN:	9781119289647
Publisher:	JOHN WILEY & SONS INC
Release Date:	June of 2018
Language:	English
Cover:	Hardcover
Pages:	464
Format:	Book
Collection:	Ieee Press
Categories:	Books in English > Science > Mathematics Books in English > Engineering > Electricity and Energy Books in English > Others
EAN:	9781119289647

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