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Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion Barrier Ru For Cu Interconnect eBook
idioma: inglês
Editor:
Springer Nature Singapore, setembro de 2017 ‧
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118,59€
10% DESCONTO
CARTÃO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789811061653 |
| Editor: | Springer Nature Singapore |
| Data de Lançamento: | setembro de 2017 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | |
| Coleção: | Springer Theses |
| Classificação Temática: |
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| EAN: | 9789811061653 |
| Acessibilidade: | Ver características de acessibilidade indicadas pelo editor |
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