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Power, Thermal, Noise, And Signal Integrity Issues On Substrate/Interconnects Entanglement eBook
idioma: inglês
Editor:
CRC PRESS, março de 2019 ‧
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74,19€
10% DESCONTO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780429680069 |
| Editor: | CRC PRESS |
| Data de Lançamento: | março de 2019 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | |
| Classificação Temática: |
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| EAN: | 9780429680069 |
| Acessibilidade: | Ver características de acessibilidade indicadas pelo editor |
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