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Microwave And Millimeter-Wave Electronic Packaging eBook
idioma: inglês
Editor:
ARTECH HOUSE, Janeiro de 2013 ‧
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99,38€
10% DESCONTO
CARTÃO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781608076987 |
| Editor: | ARTECH HOUSE |
| Data de Lançamento: | Janeiro de 2013 |
| Idioma: | Inglês |
| Páginas: | 280 |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | PDF para ADE |
| Classificação Temática: |
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Eletricidade e Energia
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| EAN: | 9781608076987 |
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