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Microwave And Millimeter-Wave Electronic Packaging
idioma: inglês
Editor:
ARTECH HOUSE PUBLISHERS, dezembro de 2013 ‧
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113,56€
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SINOPSE
Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781608076970 |
| Editor: | ARTECH HOUSE PUBLISHERS |
| Data de Lançamento: | dezembro de 2013 |
| Idioma: | Inglês |
| Encadernação: | Capa dura |
| Páginas: | 280 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
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Eletricidade e Energia
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| EAN: | 9781608076970 |
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