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Introduction To Microsystem Packaging Technology eBook
idioma: inglês
Editor:
Taylor and Francis Group, dezembro de 2017 ‧
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88,76€
10% DESCONTO
CARTÃO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781351832977 |
| Editor: | Taylor and Francis Group |
| Data de Lançamento: | dezembro de 2017 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Classificação Temática: |
eBooks em Inglês
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Engenharia Geral
eBooks em Inglês > Engenharia > Eletricidade e Energia |
| EAN: | 9781351832977 |
| Acessibilidade: | Ver características de acessibilidade indicadas pelo editor |
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