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Introduction To Microsystem Packaging Technology
idioma: inglês
Editor:
TAYLOR & FRANCIS INC, setembro de 2010 ‧
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283,89€
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SINOPSE
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781439819104 |
| Editor: | TAYLOR & FRANCIS INC |
| Data de Lançamento: | setembro de 2010 |
| Idioma: | Inglês |
| Encadernação: | Capa dura |
| Páginas: | 232 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Engenharia Geral
Livros em Inglês > Engenharia > Eletricidade e Energia |
| EAN: | 9781439819104 |