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Introduction To Microsystem Packaging Technology eBook
idioma: inglês
Editor:
CRC PRESS, dezembro de 2017 ‧
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88,76€
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
DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781439865972 |
| Editor: | CRC PRESS |
| Data de Lançamento: | dezembro de 2017 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | PDF para ADE |
| Classificação Temática: |
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| EAN: | 9781439865972 |
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