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Three-Dimensional Integration Of Semiconductors
Processing, Materials, And Applications
idioma: inglês
Editor:
Springer International Publishing AG, março de 2019 ‧
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175,73€
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CARTÃO
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SINOPSE
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783319792552 |
| Editor: | Springer International Publishing AG |
| Data de Lançamento: | março de 2019 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 408 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
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Ciências Exatas e Naturais
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Química
Livros em Inglês > Medicina > Ortopedia |
| EAN: | 9783319792552 |