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Testing Of Interposer-Based 2.5d Integrated Circuits
idioma: inglês
Editor:
Springer International Publishing AG, maio de 2018 ‧
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135,18€
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SINOPSE
The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783319854618 |
| Editor: | Springer International Publishing AG |
| Data de Lançamento: | maio de 2018 |
| Idioma: | Inglês |
| Dimensões: | 156 x 234 x 11 mm |
| Encadernação: | Capa mole |
| Páginas: | 182 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9783319854618 |