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Testing Of Interposer-Based 2.5d Integrated Circuits
idioma: inglês
Editor:
Springer International Publishing AG, maio de 2018 ‧
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135,18€
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SINOPSE
The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783319854618 |
| Editor: | Springer International Publishing AG |
| Data de Lançamento: | maio de 2018 |
| Idioma: | Inglês |
| Dimensões: | 156 x 234 x 11 mm |
| Encadernação: | Capa mole |
| Páginas: | 182 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9783319854618 |