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Solder Paste In Electronics Packaging
Technology And Applications In Surface Mount, Hybrid Circuits, And Component Assembly
Editor:
SPRINGER, fevereiro de 2012 ‧
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60,82€
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VDB0M1NtcHBkbko2ZHpNMmFUVlpNbkozTW5keVNYVnRZMDVIVWxBNVlsWm9jSFJIVFUxTmEwbFZUbmRPTVZock9HeHdka2t3YTJWd2JsQkNUV2RRYkcxNWRsRlliVlJyWTFCeVkzZHFPV1J3UnpOaWNVcHFWWFpxTmxCdFpWcHVTRzU1VkRaaVJFNVNTRWwyVm5SaVZEYzVhVlpRUTBkRmJYUnhOa3B0Ym1Kb2JYZFdhRTFOWm5CcGVWcEtaelJNUjNkclVYSm9VbWhSZDBsRlUwSmlRV0pWYnpKeGRGVnJhRWhYTHpCWE5WWkxNVzVtYXpsRlJGb3dRWFl5YlZnelVtUnBPREZCV2pOamRYZElWV2swTTA0dk5teG1aa0V2U1ZOeEx6ZEVOM2hvYkdwRGVFRXhWbFpPYzNCSVNWQk5TRk12YkRkVFp6a3ZhRmMyZFdOWGFYUlFTak5VTkhad2VqVlphbWRPVFdoWGNFeHBkVzlCT1dGcGFERmxlRGxFUVZKWWFXVnhWbEZDYUhrdmVsaHlORFE0UldwYWJuVjFNRzVzTjFBNWFUa3JNMXBPWjNWbGNuRlRhbFZTZEVRMVN6WjJSRUZsY2l0TlEyWTBNM05aYkhJemJYUXdVRnAwTURZMU1GaHVTV1ZrVkZWdU1XdE5iMlZuZGpRdk4yWnNRaTg0Vm1ZMGFqQkxaM2hyWTBSSU9Xd3ZObmQyYW5NM1puSjVOVGwwZFROVFZtd3hNSE5yZG1OaWJFdHFNbVJEYUVSblF6aHVWVFpCYzJWa1NISlpPWFJhZVU5eVpqRnFSRTloWmxGaFJtaFRXVXM0ZFVNeWVrbFNWa1Y2ZEZneU5YZGFUWFJDU1Zsc1VrUlliVzFrVUU1alRHUklNMnRaVjIxM2NYSTBhMDlzVW1zd2VubHFlRWxJV2tNMFMxZG5SMkk0VnpOUlp6RlFVakZJSzNkSU5WRnlWbmh2U3pobVJ6SXZNM1FyZG1adFJtWkxPVGgzWmpWVlkzbENVa0pWWjNkemNtbDFNbFpNUTNveGVFdENSRTU1VlhSUk9DOHhiblpHYkZaMU4waEJUbkZOYm1OQlNqUk5hMmsxZUZOQldHdE1lRmRDUWpOS09YTjFSM28wWlRsNVVUZHVRVkZyVmtkSU1IZE9OMmd5V0ZGRlN6TjZhV2t4ZHpSWlptcExZa3BqWTJSbVZuZzVTRU5hYTBSRldtRlJUbUZwZUhORE9HaGxabWRDY1hVcmVUTlpVVm95VlUxeFdVUktaV05yU0ROM09FcHhTMDhyZUd4a2MzYzRTbFZSVEU0elRFaEdSMUJtWTBSV04zTnlZMEpTVjBONFdYZEZlV05DVVVwa0szTlZWV3BNTHpKdmMxVXZUM1VyVFV4dUwwaEtTVUZUY0VKcmVXNWhlaTlvUjNodFRtNXhhREJ1WVVscFprVTFVM2RHYTFoblFUSTNkalJNY1U5cGNRPT06bmVFQnpQbjVuSjBBZXp3OWZEQ2FWUT09
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SINOPSE
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789401160520 |
| Editor: | SPRINGER |
| Data de Lançamento: | fevereiro de 2012 |
| Dimensões: | 152 x 229 x 25 mm |
| Encadernação: | Capa mole |
| Páginas: | 456 |
| Tipo de produto: | Livro |
| Coleção: | Materials Science Series |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Eletricidade e Energia
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| EAN: | 9789401160520 |
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