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Solder Paste In Electronics Packaging
Technology And Applications In Surface Mount, Hybrid Circuits, And Component Assembly
Editor:
SPRINGER, fevereiro de 2012 ‧
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SINOPSE
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789401160520 |
| Editor: | SPRINGER |
| Data de Lançamento: | fevereiro de 2012 |
| Dimensões: | 152 x 229 x 25 mm |
| Encadernação: | Capa mole |
| Páginas: | 456 |
| Tipo de produto: | Livro |
| Coleção: | Materials Science Series |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Eletricidade e Energia
|
| EAN: | 9789401160520 |
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