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Proceedings Of Asme 2021 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Interpack2021)
idioma: inglês
Editor:
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., maio de 2022 ‧
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SINOPSE
Explores the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presents 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780791885505 |
| Editor: | AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
| Data de Lançamento: | maio de 2022 |
| Idioma: | Inglês |
| Encadernação: | Capa mole |
| Páginas: | 648 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9780791885505 |
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imagem não disponívelPrint Proceedings Of The International Design Engineering Technical Conferences & Computers And Information In Engineering Conference (Detc2019): VoluPrint Proceedings Of The International Design Engineering Technical Conferences & Computers And Information In Engineering Conference (Detc2019): VoluAMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S.323,10€