Packaging Of High Power Semiconductor Lasers
Editor:
SPRINGER-VERLAG NEW YORK INC., julho de 2014 ‧
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SINOPSE
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781461492627 |
| Editor: | SPRINGER-VERLAG NEW YORK INC. |
| Data de Lançamento: | julho de 2014 |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa dura |
| Páginas: | 402 |
| Tipo de produto: | Livro |
| Coleção: | Micro- And Opto-Electronic Materials, Structures, And Systems |
| Classificação Temática: |
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| EAN: | 9781461492627 |
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