Modeling And Simulation For Microelectronic Packaging Assembly
Manufacturing, Reliability And Testing
idioma: inglês
Editor:
JOHN WILEY & SONS INC, outubro de 2011 ‧
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SINOPSE
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780470827802 |
| Editor: | JOHN WILEY & SONS INC |
| Data de Lançamento: | outubro de 2011 |
| Idioma: | Inglês |
| Encadernação: | Capa dura |
| Páginas: | 576 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9780470827802 |