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Materials, Processes, Integration And Reliability In Advanced Interconnects For Micro- And Nanoelectronics: Volume 990
Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.
idioma: inglês
Editor:
CAMBRIDGE UNIVERSITY PRESS, junho de 2014 ‧
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SINOPSE
This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781107408715 |
| Editor: | CAMBRIDGE UNIVERSITY PRESS |
| Data de Lançamento: | junho de 2014 |
| Idioma: | Inglês |
| Dimensões: | 152 x 229 x 19 mm |
| Encadernação: | Capa mole |
| Páginas: | 358 |
| Tipo de produto: | Livro |
| Coleção: | Mrs Proceedings |
| Classificação Temática: |
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| EAN: | 9781107408715 |
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