Hybrid Systems-In-Foil
idioma: inglês
Editor:
CAMBRIDGE UNIVERSITY PRESS, outubro de 2021 ‧
ver detalhes do produto
24,33€
10% DESCONTO
CARTÃO
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
portes grátis
Venda o seu livro
SINOPSE
An introduction to the Hybrid Systems-in-Foil (HySiF) concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided, several bendable electronic components are presented demonstrating the benefits of HySiF, and prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781108984744 |
| Editor: | CAMBRIDGE UNIVERSITY PRESS |
| Data de Lançamento: | outubro de 2021 |
| Idioma: | Inglês |
| Dimensões: | 228 x 154 x 9 mm |
| Encadernação: | Capa mole |
| Páginas: | 92 |
| Tipo de produto: | Livro |
| Coleção: | Elements In Flexible And Large-Area Electronics |
| Classificação Temática: |
Livros em Inglês
>
Engenharia
>
Eletricidade e Energia
|
| EAN: | 9781108984744 |
LIVROS DA MESMA COLEÇÃO
-
A Flexible Multi-Functional Touch Panel For Multi-Dimensional Sensing In Interactive Displays10%CAMBRIDGE UNIVERSITY PRESS24,33€ 10% CARTÃOportes grátis
-
1d Semiconducting Nanostructures For Flexible And Large-Area Electronics10%CAMBRIDGE UNIVERSITY PRESS24,33€ 10% CARTÃOportes grátis