adicionar à lista de desejos
3d Stacked Chips
From Emerging Processes To Heterogeneous Systems
idioma: inglês
Editor:
Springer International Publishing AG, maio de 2018 ‧
ver detalhes do produto
60,82€
10% DESCONTO
CARTÃO
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
portes grátis
Venda o seu livro
SINOPSE
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783319793054 |
| Editor: | Springer International Publishing AG |
| Data de Lançamento: | maio de 2018 |
| Idioma: | Inglês |
| Dimensões: | 156 x 234 x 19 mm |
| Encadernação: | Capa mole |
| Páginas: | 339 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
>
Engenharia
>
Eletricidade e Energia
|
| EAN: | 9783319793054 |