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3d Stacked Chips
From Emerging Processes To Heterogeneous Systems
idioma: inglês
Editor:
Springer International Publishing AG, maio de 2018 ‧
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60,82€
10% DESCONTO
CARTÃO
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SINOPSE
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783319793054 |
| Editor: | Springer International Publishing AG |
| Data de Lançamento: | maio de 2018 |
| Idioma: | Inglês |
| Dimensões: | 156 x 234 x 19 mm |
| Encadernação: | Capa mole |
| Páginas: | 339 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Eletricidade e Energia
|
| EAN: | 9783319793054 |