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3d Microelectronic Packaging
From Architectures To Applications
idioma: inglês
Editor:
SPRINGER VERLAG, SINGAPORE, novembro de 2021 ‧
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216,29€
10% DESCONTO
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SINOPSE
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789811570926 |
| Editor: | SPRINGER VERLAG, SINGAPORE |
| Data de Lançamento: | novembro de 2021 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 622 |
| Tipo de produto: | Livro |
| Coleção: | Springer Series In Advanced Microelectronics |
| Classificação Temática: |
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| EAN: | 9789811570926 |
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