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3d Microelectronic Packaging
From Architectures To Applications
idioma: inglês
Editor:
SPRINGER VERLAG, SINGAPORE, novembro de 2021 ‧
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216,29€
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SINOPSE
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789811570926 |
| Editor: | SPRINGER VERLAG, SINGAPORE |
| Data de Lançamento: | novembro de 2021 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 622 |
| Tipo de produto: | Livro |
| Coleção: | Springer Series In Advanced Microelectronics |
| Classificação Temática: |
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| EAN: | 9789811570926 |
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