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3d Microelectronic Packaging
From Fundamentals To Applications
idioma: inglês
Editor:
Springer International Publishing AG, julho de 2018 ‧
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216,29€
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SINOPSE
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783319830865 |
| Editor: | Springer International Publishing AG |
| Data de Lançamento: | julho de 2018 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 463 |
| Tipo de produto: | Livro |
| Coleção: | Springer Series In Advanced Microelectronics |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Engenharia Geral
Livros em Inglês > Engenharia > Engenharia Mecânica |
| EAN: | 9783319830865 |
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